ANSYS ICEPAK TRAINING PDF

This course provides an introduction to conducting thermal simulations for electronics in ANSYS Icepak. The course devotes very little time to CFD & thermal. Based on the state-of-the-art ANSYS FLUENT CFD solver, ANSYS Icepak To get more out of ANSYS try one or more of our simulation training courses. ANSYS Icepak Introductory Course at ANSYS UK, listed on – a comprehensive database of CPD courses in the UK & Ireland.

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For more than a decade, ttraining around the globe have relied on Icepak to carry out rapid heat transfer and fluid flow analyses of IC packages, printed circuit boards, electronic assemblies and complete products.

Icepak enables you to easily make design tradeoffs and validate those modifications before building physical prototypes, reducing cost and time to market.

Leading companies around the world trust ANSYS Icepak software to provide robust and powerful computational fluid dynamics technology for electronics thermal management.

It has trajning interactive interface with capabilities like smart objects for rapid electronic model creation. Icepak has additional customization capabilities that can improve customer productivity. Body fitted meshing captures the complex curvatures and results in accurate thermal analysis. Icepak has the best-in-class solver.

Advanced post-processing capabilities can help in analyzing air flow and temperature on components, thus improving design performance and reducing the need for physical prototypes. ANSYS Icepak software contains many productivity features that enable quick creation and simulation of electronics cooling models of integrated circuit IC packages, printed circuit boards and complete electronic systems.

Models are created by simply dragging and dropping icons of predefined objects — including cabinets, fans, packages, circuit boards, vents and heat sinks — to create models of complete electronic systems. These smart objects capture geometric information, material properties, meshing parameters and boundary conditions — all of which can be parametric for performing sensitivity studies and optimizing designs. Icepak contains advanced meshing algorithms to automatically generate high-quality meshes that represent the true shape of electronic components.

Options include hex-dominant, unstructured hexahedral and Cartesian meshing, which enable automatic generation of body-fitted meshes with minimal user intervention.

The mesh density can be localized through nonconformal interfaces, which allow inclusion of a variety of component scales within the same electronics cooling model.

While fully automated, Icepak contains many mesh controls that enable customization of the meshing parameters to refine tdaining mesh and optimize the trade-off between computational cost and solution accuracy.

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This meshing flexibility results in the fastest solution times possible without compromising accuracy.

ANSYS Icepak solves for fluid flow and includes all modes of heat transfer — conduction, convection and radiation — for both steady-state and transient thermal flow simulations. The solver uses a multigrid graining to accelerate solution convergence for conjugate heat transfer problems. It has complete mesh flexibility and solves even the most complex electronic assemblies using unstructured meshes — providing robust and extremely fast solution times.

ANSYS Trainin software contains a full suite of qualitative and quantitative post-processing tools to generate meaningful graphics, animations and reports that can readily convey simulation results to colleagues and customers.

ANSYS Training – CFD

Visualization of velocity vectors, temperature contours, fluid particle traces, isosurface displays, cut planes and x—y plots of results data are all available for interpreting the results of lcepak electronics cooling simulation.

Customized reports, including images, can be automatically created for distributing results data, identifying trends in the simulation, and reporting fan and blower operating points.

The software runs different boundary condition scenarios to obtain temperature and heat flux values, which are used to create an optimized thermal network model. The optimized DELPHI network model can easily be included in a system-level simulation, which allows accurate prediction of junction temperatures of IC components in a system-level thermal simulation.

ANSYS Icepak – FEA, CFD and Explicit Dynamics

For printed circuit boards, localized orthotropic thermal conductivity can be determined from the electronic trace and via information for the printed circuit board layers. This enables accurate representation of thermal conduction in the board, which provides increased fidelity in predicting internal temperatures and component junction temperatures.

ANSYS Icepak provides a bi-directional and iterative link with SIwave to account for heating due to copper resistive losses in printed circuit boards and packages.

The coupling also enables prediction of both internal temperatures and accurate component junction temperatures within packages. ANSYS structural mechanics software can model both linear and nonlinear structural mechanics for static and dynamic systems. Coupling between Ice;ak Icepak and structural mechanics allows you icepa evaluate the temperatures and resulting thermal stresses of trainlng components.

These libraries enable rapid creation of electronics cooling models.

Libraries include data for:. While Computational Fluid Dynamics CFD has been used very successfully for large thermal simulations, icepwk CFD models are typically too time consuming for repeated transient thermal analysis. Reduced order models ROM can be applied to such big and complex thermal systems to generate accurate and faster responses: Many thermal systems are linear and time invariant LTIand can be modeled as state space models in Simplorer.

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The Icepak—Simplorer coupling workflow uses this technology and helps you to obtain faster and more accurate results from the reduced state space model. It applies design of experiment DoE algorithms to efficiently and scientifically factor the design space, and uses state-of-art response surface technology to interpolate results and calculate result sensitivity for a given set of input variables.

As the product complexity continues to grow, more computation resources and data storage are required to conduct large, anays system-level simulation.

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To address this situation, traiming are moving to cloud computing implementation to significantly reduce IT process complexity and enable cost-effective access to HPC resources for CAE engineers.

High power, high frequency applications can produce a lot of heat dissipation in both metal conductors and dielectrics, adversely affecting operational reliability as well as product robustness. An easy drag-and-drop option in the Workbench platform facilitates two-way HFSS—Icepak data transfer, enabling users to accurately study the electrical and thermal aspects of such applications.

Two-way coupling between Maxwell and Icepak enables you to accurately explore cooling of these trianing and the impact of heat on their overall trxining. A iceppak coupling between Q3D and Icepak enables you to accurately study the electrical and thermal aspects of such applications. Overview Leading companies around the world trust ANSYS Icepak software to provide robust and powerful computational fluid dynamics technology for electronics thermal management.

Features Icepak Objects ANSYS Icepak software contains many productivity features that enable quick creation and simulation of electronics cooling models of integrated circuit IC packages, printed circuit boards and complete electronic systems. Flexible and Automatic Meshing Icepak contains advanced meshing algorithms to automatically generate high-quality meshes that represent the true shape of electronic components.

Results Visualization ANSYS Icepal software contains a full suite of qualitative and quantitative post-processing tools to generate meaningful graphics, animations and reports that can readily convey simulation results to colleagues and customers. Joule Heating Multiphysics ANSYS Icepak provides a bi-directional and iterative link with SIwave to account for heating due to copper resistive losses in printed circuit boards and packages.

Libraries include data for: